What is ANT?

First established on the 1st October 2005, Access Network Technologies (ANT) Program is today providing R&D activities and related services in areas of access technologies for fixed, wireless, mobile and also the future fixed-wireless convergence in communication. It establishment is inline with the restructuring and repositioning of TM Research & Development to focus on Design and Development (DD) of product & solution for in used in IP-based network. This is also coherent with the future deployment TM’s networks infrastructure which focus on IP-based technologies for the wired and wireless communication. The operation of ANT Program based on technology clusters which the main goals are to drive and generate product development for fixed, wireless and mobile market segment. The “ANT” is the name of insect that has strong character and behavior in “team work” and “inter personal communication”. So, this symbolizes the R&D culture that will be nurture and developed within ANT Program to produce highly skilled researchers. The technology cluster is Antenna, Satellite & Broadcasting, Wireless & Mobile IP-Access, Wire line & IP-Access and Customer Premise Equipment (CPE) & Multimedia Terminal.

Electromagnetic Compatibility Solution

EMC Definition: The ability of electrical equipment to function satisfactorily in its electromagnetic environment without affecting other equipment in this environment to an impermissible extent

Electromagnetic Compatibility Laboratory Facilities

EMC Laboratory offers:
• design expertise on EMC testing
• in-depth assessment and testing of electronic and telecommunication equipment due to EMC related problem
• Conduct full immunity test (with compatible software) and conducted emission software with future expansion with receiver. Application Areas:
• Telecommunications network equipments Facilities:
• GTEM CELL (3m long)
• Wide range of RF amplifiers 80MHz up to 3GHz
• Wide range De-coupler 10kHz up to 3GHz
• Wide band Field Probe 100kHz up to 3GHz
• Pre-Amplifiers 10kHz to 3GHz
• Power meter 10kHz to 3GHz
• Full RF integration cabling system
• Full compliance radiated immunity test system
• Radiated/conducted emission software
• Spectrum analyzer 100 Hz up to 3GHz and 9khz up to 18 GHz
• Signal Generator 9khz up to 3.2 GHz and 1Ghz up to 18 GHzLaboratory operation:
• Determination of upset or failure thresholds of equipment and systems
• Testing or design/testing consultancy
• Surveys and assessment of equipment and systems Specifications test to include:
• CISPR 22
• EN 50082-1
• EN 50082-2
• IEC 801-3
• IEC 804-4 Collaboration partner:
• KUITTHO, Batu Pahat, Johor (2004-2005)

Lightning Protection Laboratory's Main Approch to the Customers

Lightning Protection and Electromagnetic Compatibility (EMC)

Background

Established in 1995 as the Network Protection Unit, the Lightning Protection & EMC Unit (LP&EMC) embarks on lightning protection system, emphasizing on 3 major studies of lightning protection system. They are secondary protection effect, direct strike protection and bonding/grounding. The studies aim at ensuring that optimum lightning protection is applied without incurring cost/weight penalties for over-protection and avoid costly failures arising from under-protection. With the constantly increasing regulatory framework and safety standards, it is essential that companies anticipate future changes in lightning protection standards. In 1996, LP&EMC started to focus on the secondary effects of lightning on telecommunication equipments and facilities. This was done with the emphasis on surge protection device technologies. Hence, collaborations with TM, UTM and NTT, incorporating the Malaysian Standard MS 1460:1999, were established.Later in 1999, LP&EMC directed its attention to lightning direct strike protection through collaborations with UTM and NTT for the revision of Malaysian Standard MS 939. The new method for direct strike protection was installed; CTS (Charge Transfer System) or DAS ( Dissipation Array System).
In 2002, LP&EMC worked on grounding system modeling with the help of C DEGS software and the studies on lightning electromagnetic pulse (LEMP) of shielding effectiveness. At the same time, LP&EMC focused on designing a high power semiconductor device. Later in 2003, LP&EMC started the studies of measurement techniques for ground surge impedance in collaboration with UTM and MMU. With the establishment of EMC lab in the same year, studies of EMC-related problems and issues were expanded.
At present, the objectives of the LP & EMC are:
1. To develop means of protecting life and property from loss by lightning.
2. To assure greater public safety by extending the use of proper lightning protection systems.
3. To initiate and conduct lightning protection research and development.
4. To formulate and promote standards for lightning protection materials and systems.
5. To test and certify lightning protection system designs, installations, and inspections.
6. To promote and enforce high standards of quality and safety in the design and installation of lightning protection systems.
7. To promote EMC testing and research. Lightning Protection Laboratory offers:
• design expertise and testing using generators which simulate the high current and high
• voltage aspects of lightning strikes
• in-depth assessment and testing of electronic and surge protection devices
• management of national lightning protection R&D project
• direct strike protection
• Grounding and Bonding Application Areas:
• Telecommunication networks operations
• Telecommunication equipments Facilities:
• Surge Generator PSurge 30 with 1.2/50µs,8/20µs combination waveform, 30kV, 15kA and 8/20µs current waveform up to 30kA
• Surge Generator PSurge 6 with single waveform module: 100kHz ring- wave up to 6kV,500A, 10/700µs open circuit up to 6kV, 1/1000µs open circuit 6kV, 8/20us short circuit up to 6kV, 1.2/50µs and 8/20µs combination modul 6kV,3kA
• Surge Generator NSG 2050 1.2/50µs,8/20µs combination waveform up to 6kV, 3kA.
• Meger Det 2/2 1000 k? Ground Tester
• Siscal digital Soil Resistivity Tester Laboratory operation:
• Determination of upset or failure thresholds of equipment and systems
• Testing or design/testing consultancy
• Mobile test generators for fixed-equipment testing
• Surveys and assessment of equipment and systems Specifications test to include:
• ITUT-K series including K20, K21, K30, K35, K39, K44 and K45.
• IEC 1024-1
• IEC-1000-5Collaboration partners:
• UTM (2005 – 2006)
• MMU (2004)
• NTT, Japan (1996-1999)

Photonic Facilities

Photonic Expertise

1. CD management
Basic mathematical equations governing CD in optical fibre
Fibre parameters & Fibre types
CD causes & effects (chirp, direct modulation
CD classification (normal, anomalous; waveguide, materials, profile; etc)
CD measurement (techniques & requirements) AND applicable standards
CD mitigation / compensation methods 2. PMD management
Basic mathematical equations governing PMD in optical fibre
Fibre parameters & Fibre types
PMD causes & effects
PMD classification (1st order, 2nd order; etc)
PMD measurement (techniques & requirements) AND applicable standards
PMD mitigation / compensation methods 3. Loss/Power management
Loss sources (components, fibre length, connectors, splicing etc)
Link / Power budget (transmitter power, receiver sensitivity, overload parameter, transmission length, etc)
Optical amplifier types (EDFA, FRA, PDFA; booster, inline, pre-amplifier; single stage, double stage; single amplifier, cascade amplifiers, etc)
Optical amplifier parameters (max gain, gain saturation, gain flatness, noise figure, ASE)
OSNR, SMSR, ER (equation, requirement, effect, etc)
Nonlinear Effects in optical fibre (XPM, SPM, FWM etc) 4. Nonlinearity management
Basic mathematical equations governing Nonlinearity in optical fibre
Nonlinearity types (SPM, XPM, FWM, etc)
Soliton transmission
Optimum transmitted power
Dispersion effect on Nonlinearity
Channel spacing (100GHz, 50GHz, random etc)
Bit-rate & Bandwidth
Modulation format & technique (NRZ, RZ; direct modulation, external modulation; etc) 5. Transmission design
Experimental studies: measurements of the system under study, manipulating the system, and then taking additional measurements
Observational studies: uses a survey to collect observations about the area of interest and then perform statistical analysis 6. Traffic and network management
Model the node architectures and routing algorithms using simulation software
Create the best routing algorithms based on network topology proposed
Test the network performance using simulation software 7. Routing algorithm and network architecture
Routing algorithm schemes (existing and future)
Network Design: Network architecture topology
Perform accurate simulation
Experimental studies: measurements of the system under study, manipulating the system, and then taking additional measurements
Observational studies: uses a survey to collect observations about the area of interest and then perform statistical analysis 8. Hardware realization
Opto-Electronics Design & Realisation: design of sub-systems that consist of both optical and electrical components and constructing the design into a working prototype
Testing and Optimisation: conducts standard performance test and optimising the sub-systems to achieve best performance
Technical Competency: has to be updated with the physics of the hardware (optical & electronics) and software coding 9. Network design and analysis
Business planning i.e. determines the planning that the operator must perform to ensure that the network will perform as required for its intended life-span
Long-term and medium-term network planning
Short-term planning
Operations and maintenance i.e. examines how the network will run on a day-to-day basis 10. Course Wavelength Division Multiplexing Array Waveguide Devices
Theoretical studies: understanding the physics and concept of the devices under study
Designing the devices: uses commercial software to design the devices
Alignment studies: passive optical alignment
Packaging studies: epoxy attachment
Devices testing: Telcordia testing for passive devices
Planar Lightwave Circuit (PLC) alignment and packaging
Damp heat test for PLC follow Telcordia standard
Characterization of PLC component using JDS Testing Equipment
Provide training on software –BeamPROP, FullWAVE, BAndSOLVE, OptiWAVE, Matlab
Design servi for Directional Coupler and Optical splitter
Fiber lens design 11. PLC chip – fiber alignment
Alignment studies: study on how to reduce time for alignment process between fiber array and PLC Chip. This study will led to overall cost reduction of the PLC component. 12. PLC chip attachment
Attachment studies: Study on optimal optical adhesive dispensing between the fiber array and PLC chip for strong and durable bonding. High quality chip bonding improve lifetime of the PLC component. 13. PLC chip testing
Devices testing: Characterization of the PLC component and Telcordia testing for passive devices using state-of-the-art testing equipment JDS. Characterization on the PLC component is required to ensure the specification of the PLC component is comparable to the commercially available in the market. While Telcordia testing ensure the reliability and durability of the PLC component against the external factor ie; humidity, temperature, g-shock and stress.

Research Interest

Photonic TransmissionThe Photonics Transmission Cluster (PTC) at TM R&D is under the Photonics Technology Programme which, in turn, is one of the programmes under the Basic Research Department. Other clusters under the Photonics Technology Program led by Mr. Romli Mohamad are The Photonics Network Cluster (PNC) and The Photonics Devices Cluster (PDC). The photonics work also extends to advanced communication system concepts, including coherent detection in single-mode fiber, spatial multiplexing in multi-mode fiber, and free-space links. The current scopes / areas of research under the PTC are:
CD Management
PMD Management
Loss / Power Management
Nonlinearity Management
Transmission Design Photonic NetworkThe Photonics Network group at TM R&D is in the Photonics Research Program of the Basic Research Department. The current scope of research includes:
Traffic and Network Management studies for future broadband Access and Metro Optical Networks.
Routing Algorithms and Node Architecture studies (routing methods, OXC & OADM architectures)
Hardware realization of network sub-systems for optical networks
Network Design and performance analysis Photonic DevicesThe Photonics Devices group at TM R&D is in the Photonics Research Program of the Basic Research Department. The current scope of research includes:

1. Modelling and designing Planar Lightwave Circuit (PLC) components such as splitter, directional coupler and multimode interferometer. All this passive photonic devices is a main component in photonic network.
2. Work on the fundamentals of fabrication technologies includes fabrication of PLC components using Plasma Enhanced Chemical Vapor Deposition (PECVD).
3. Studies on passive alignment between fiber array and PLC chips to achieve low loss, reliable and compact PLC component.
4. Studies on epoxy attachment between fiber array and PLC chip to achieve Telcordia standard.
5. Develop testing procedure according to Telcordia standard.
6. Studies on new photonic materials such as Photonic Crystals in order to design small and compact PLC components.

Photonic Technology

Introduction

Due to the remarkable progress of technological innovations in the telecommunication industry, photonic technologies for telecommunication networks are gaining more and more significance. Photonic Technology Program is working on the research and development of optical communications, networking, photonic, optical subsystem design and device technology that supports such next generation innovations since 2000. The operation of Photonic Technology Program based on Basic Research Department which the main goals are to drive and generate product and development for next generation optical communications. The clusters are Photonic Network, Photonic Transmission and Photonic Devices. Photonic Technology laboratories have developed the leading-edge optical system by combining three core technologies: namely photonic network technology, photonic transmission and photonic device technology. The achievement of R&D contributes to the advancement and economization of the network of TM. Our R&D results are also supplied to the society globally through technology transfers and commercialization in TM group companies.

Potential Services

As provided with state of the art research tools for micro and nano devices R&D, MENT potentially able to offer contract research or services for: i) Nano scale surface imaging and analysis using Scanning Electron Microscopy (SEM), ii) Atomic Scale perfect and nearly perfect epitaxy analysis deploying HR-XRD through rocking curve and reciprocal techniques. In the near future upon acquiring additional attachment, powder diffraction techniques also able to be offered, iii) RF on Wafer (RFOW) and module characterization of frequency up to 40 GHz, iv) Micro scale defect imaging using Metrology Microscope, v) Bragg mirror analysis using UV-VIS spectrometer, vi) Nano scale elemental analysis using EDAX, vii) Electrical characterization and analysis using CV/IV, Four Point Probes, Micro Probe (TM R&D Patent Pending) and hall effect, viii) Materials thermal conductivity and impedance analyzer to be available in Julai 2006. In near future MENT is anticipated able to provide nano technology characterization capability by deploying Surface Probe Microscopy (SPM) and Focus Ion Beam (FIB) facility.

Expertise

MENT expertise was tailored in accomplishment of High Electron Mobility Transistor Process Development, High Power Lightning Protection Device Design and Ring & Doped Optical Fiber Model. Currently, MENT researchers actively involved in R&D of Alumina Materials PWB, Multilayer Co-fired Alumina PWB, RF over Fiber Modulator WiFi Module, Monolithic Microwave Integrated Circuit (MMIC) Process, Metamorphic High Electron Mobility Transistor (MHEMT) Design for application beyond 40 GHz, Lightning Protection Suppressor Devices and 980nm Vertical Cavity Surface Emitting Laser (VCSELs). MENT researchers also actively support other TM R&D research activities through providing consultation such RFoW & module test to Wireless Devices Research Group and materials analysis techniques to EMC/LP and Photonic Technology Research Group. In conjunction lacking of researchers, laboratory space and expertise, MENT had accomplished collaboration with University Kebangsaan Malaysia (UKM), Malaysia Institute for Nuclear Technolgy (MINT), Universiti Putra Malaysia (UPM), Universiti Sains Malaysia (USM), Malaysia Multimedia University (MMU), Malaya University (MU) and Institute Technology Bandung (ITB). MENT in addition working with Business Development Group are going to promote the materials characterization, RF on Wafer (RFoW) Test, contract research and other potential services to national customer as a part of revenue generation to TM R&D.

Introduction

Today's modern telecommunications and sensing applications require an increasing bandwith to accomodate for the enormous amounts of information being transported over fiber-optic and wireless networks. These requirements place huge demands on the active device and sub-system technologies for millimetre-wave applications in terms of inherent bandwidth and noise performance. For frequencies of 30GHz and higher, new materials and devices are needed. Hence, the research and development (R&D) for microwave devices in Telekom Malaysia was first established in late year 1997.

Apart of TM R&D realignment effort in November 2005, MENT Program was established to include the R&D initiatives of optoelectronics and nano devices development for future telecommunication applications. The MENT R&D activities today’s focusing to drive and develop micro-nano devices for future consumption of fixed, wireless, mobile and fixed-wireless convergence in information communication technology (ICT) market segment. The effort will shove the future deployment of TM’s networks infrastructure with local technology development which focus on IP-based for the wired and wireless communication. The program technology initiatives are now clustered into Epitaxy Materials, Fabrication Process, Microwave Test & Applications, Electron Devices, Optoelectronics Devices and High Speed Interconnect Technology.